? semiconductor components industries, llc, 2012 october, 2012 ? rev. 2 1 publication order number: df6a6.8fut1/d df6a6.8fut quad array for esd protection this quad voltage suppressor is designed for applications requiring transient overvoltage protection capability. it is intended for use in voltage and esd sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. its quad junction common anode design protects four separate lines using only one package. these devices are ideal for situations where board space is at a premium. specification features ? sc ? 88 package allows four separate unidirectional configurations ? low leakage < 1 a @ 5 volt ? breakdown voltage: 6.4 ? 7.2 volt @ 5 ma ? low capacitance (40 pf typical) ? esd protection meeting 61000 ? 4 ? 2 level 4 and 16 kv human body model ? these are pb ? free devices mechanical characteristics ? void free, transfer ? molded, thermosetting plastic case ? corrosion resistant finish, easily solderable ? package designed for optimal automated board assembly ? small package size for high density applications maximum ratings (t a = 25 c unless otherwise noted) rating symbol value unit peak power dissipation @ 8 x 20 s (note 1) p pk 75 watts steady state power dissipation (note 2) p d 385 mw thermal resistance ? junction ? to ? ambient derate above 25 c r ja 328 3.0 c/w mw/ c maximum junction temperature t jmax 150 c operating junction and storage temperature range t j , t stg ? 55 to +150 c esd discharge mil std 883c ? method 3015 ? 6 iec61000 ? 4 ? 2, air discharge iec61000 ? 4 ? 2, contact discharge v pp 16 16 8 kv lead solder temperature (10 seconds duration) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. 1. per waveform figure 1 2. mounted on fr ? 5 board = 1.0 x 0.75 x 0.062 in. sc ? 88 case 419b ? 02 http://onsemi.com 6 4 1 3 device package shipping ? ordering information df6a6.8fut1g sc ? 88 (pb ? free) 3000/tape & reel marking diagram 5 2 df6a6.8fut2g 3000/tape & reel sc ? 88 (pb ? free) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. 68 m 68 = specific device code m = date code = pb ? free package 1 6 (note: microdot may be in either location.) 1
df6a6.8fut http://onsemi.com 2 v ? i curve i f v i i r i t v rwm v br v f electrical characteristics device device marking breakdown voltage v br @ 5 ma (volts) leakage current i rm @ v rwm = 5 v typical capacitance @ 0 v bias max v f @ i f = 10 ma max z z @ 5 ma max z zk @ 0.5 ma min nom max ( a) (pf) (v) ( ) ( ) df6a6.8fut1g 68 6.4 6.8 7.2 1.0 40 1.25 30 300 df6a6.8fut2g 68 6.4 6.8 7.2 1.0 40 1.25 30 300 figure 1. 8 20 s pulse waveform 100 90 80 70 60 50 40 30 20 10 0 020406080 t, time ( s) % of peak pulse current t p t r pulse width (t p ) is defined as that point where the peak current decay = 8 s peak value i rsm @ 8 s half value i rsm /2 @ 20 s figure 2. capacitance 45 40 35 30 50 25 15 20 10 01 3 5 bias voltage (volts) typical capacitance (pf) 4 2 1 mhz frequency figure 3. forward voltage figure 4. clamping voltage versus peak pulse current 0.6 0.7 0.8 0.9 v f , forward voltage (volts) 10 1 8 9 10 12 v c , clamping voltage (volts) i , peak pulse current (amps) pp 1.0 1.1 1.2 i , forward current (a) f 11 8 x 20 s per figure 1 0.0001 0.01 0.1 1 0.001
df6a6.8fut http://onsemi.com 3 package dimensions sc ? 88/sc70 ? 6/sot ? 363 case 419b ? 02 issue w notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419b ? 01 obsolete, new standard 419b ? 02. e 0.2 (0.008) mm 123 d e a1 a a3 c l 654 ? e ? b 6 pl dim min nom max millimeters a 0.80 0.95 1.10 a1 0.00 0.05 0.10 a3 b 0.10 0.21 0.30 c 0.10 0.14 0.25 d 1.80 2.00 2.20 0.031 0.037 0.043 0.000 0.002 0.004 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 min nom max inches 0.20 ref 0.008 ref h e h e e 1.15 1.25 1.35 e 0.65 bsc l 0.10 0.20 0.30 2.00 2.10 2.20 0.045 0.049 0.053 0.026 bsc 0.004 0.008 0.012 0.078 0.082 0.086 mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other intellectual property. a list ing of scillc?s product/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parame ters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 df6a6_8fut1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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